Are you looking to power the next leap in the exciting world of advanced electronics?Do you want to help solve problems that drive success in the rapidly evolving technology and connectivity landscape? Then bring your problem-solving, passion, and creativity to help us power the next leap in electronics.
AtQnity, we’re more than a global leader in materials and solutions for advanced electronics and high-tech industries – we’re a tight-knit team that is motivated by new possibilities, and always up for a challenge. All our dedicated teams contribute to making cutting-edge technology possible. We value forward-thinking challengers, boundary-pushers, and diverse perspectives across all our departments, because we know we play a critical role in the world enabling faster progress for all. Learn how you can start or jumpstart your career with us.
Qnity Electronics is seeking an experienced and motivatedApplication Engineer to join ourAdvanced Circuits& Packaging (ACP) business.
In this role, you will be part of our advanced packaging metallization team, working directly with global leaders in semiconductor manufacturing. You will drive technical development, customer engagement, and new product advancement for next‑generation electroplating materials used in semiconductor packaging.
This position plays a key role in developing electrodeposition technologies for metals such aslead‑free solder (SnAg, Pure Sn), copper (Cu pillar, RDL, Damascene, TSV), and other advanced metallization applications.
Key Responsibilities
- Collaborate closely with Korea R teams and communicate effectively with customers
- Design and execute DOEs for plating and related processes to support new product development; ensure high‑quality, statistically robust data
- Engage directly with customers on plating chemistry, solder bumping, RDL, TSV, Damascene and other electroplating process technologies
- Coordinate with global teams in Asia Pacific and North America to support NPD and technical programs
- Drive safety excellence within the ACP Metallization R Lab and lead safety improvement actions
- Contribute to intellectual property development related to new technologies and applications
Qualifications
- Bachelor’s or Master’s degree in Chemical Engineering, Chemistry, Materials Science, or related field
- 4+ years of industry experience,or Ph.D. preferred
- Experience in advanced packaging, electroplating processes, or semiconductor packaging strongly preferred
- Understanding of inorganic/organic chemistry or polymer structures is a plus
- Proficiency in DOE and statistical design methodologies
- Strong English communication skills (verbal& written), including technical writing and presentations
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Qnity is an equal opportunity employer. Qualified applicants will be considered without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability or any other protected class. If you need a reasonable accommodation to search or apply for a position, please visit our Accessibility Page for Contact Information.
Qnity offers a comprehensive pay and benefits package. To learn more visit theCompensation and Benefits page.
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