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Unit Process Development Engineer for Etch
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Unit Process Development Engineer for Etch

onsemi -
경기도 부천

지금 지원하기

채용공고 세부정보

정규직
4시간 전

상세 직무 내용

Onsemi is seeking a Etch Process Development process engineer for wide bandgap technology ramp to drive fast ramp of new technologies without quality issue in manufacturing factories for wide band gap technologies. These engineers will need to work with process integration engineering team, device team, package development, product engineering from fab tool selection, module unit process development, process integration flow, to enable new technologies and new products meeting customer requirement, manufacturability, high quality, and fast time to market delivery.

These are “hands on” positions. The successful candidates are expected to be able to work independently as well as within teams. They should possess analytical skills to identify problems, the leadership skills to own and drive improvement across all aspects of new technology from feasibility to production ramp.

Responsibilities

Identify the gaps in global operations and be strong team members of unit process development engineers for technology development from feasibility to production ramp.
Develop capable processes that fit unified technology design rules.
Ensure for each technology node a complete set of process characterization for process monitoring and intrinsic/extrinsic reliability for power devices by collaborating with process integration and device engineering team.
Participate as operations representative for due diligence projects for wide band gap power products
Own process development and qualification through collaboration with process integration engineers and device engineers to successfully qualify and ramp wide band gap products.
Improve yield and cost through securing wide process window and complete understanding and reduction of process defects as a process owner.
Improve tool capability through deep understanding in tool functionality and collaboration with equipment engineering team on Continuous Improvement Projects (CIP).

Qualifications

A minimum of 8 years of experience in semiconductor engineering related field in Dry Etch process. An advanced degree is preferred in semiconductor processing, device physics or compatible disciplines.
Minimum 5+ years of hands-on experience in 8” fab with at least 0.25 um technology
Experience with wide band gap technologies
Developed and successfully ramped a technology to at least 1K wafers per a week
Experience in working and leading cross functional teams and remote factories
Ability to drive changes
Willing to travel up to 20% of the time as required.
Bucheon, Korea as a main work site.

About Us

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here:

https://www.onsemi.com/careers/career-benefits

About the Team

We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.

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